Intelligent Build.tech Issue 14 | Page 44

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IBM , the Government of Canada and the Government of Quebec sign agreements to strengthen Canada ’ s semiconductor industry

Up to CAD $ 187m to be invested to progress expansion of chip packaging capacity and capabilities and to strengthen R & D at IBM
Canada ’ s Bromont plant .

IBM , the Government of Canada and the Government of Quebec have announced agreements that will strengthen Canada ’ s semiconductor industry and further develop the assembly , testing and packaging ( ATP ) capabilities for semiconductor modules to be used across a wide range of applications including telecommunications , high performance computing , automotive , aerospace and defence , computer networks and generative AI , at IBM Canada ’ s plant in Bromont , Quebec .

One of North America ’ s largest chip assembly and testing facilities , IBM Bromont is a 24-hour-a-day , 365-day-a-year facility where over 100,000 microelectronic modules are manufactured each week .
Bromont ’ s mission is to transform the most advanced semiconductor components into state-of-the-art microelectronic solutions .
IBM Canada , the Government of Canada and the Government of Quebec have announced agreements reflecting a
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